Features 62mm footprint with reduced package height (17 mm) Low inductance, low profile footprint Reduced voltage spikes and ringing Higher switching frequency operation Improved power density Enhanced EMI...
Features • High speed switching SiC MOSFETs • Reliable body diode • All parts tested to above 1350V • Kelvin reference for stable operation • Press fit terminal connections
Features • High speed switching SiC MOSFETs • Reliable body diode • All parts tested to above 1350V • Kelvin reference for stable operation • Press fit terminal connections
