by Ben Cadwallader | Dec 23, 2025
Features • High speed switching SiC MOSFETs • Reliable body diode • All parts tested to greater than 1,350V • Kelvin reference for stable operation • Press fit terminal connections Benefits • Low switching losses • Low junction to case thermal resistance • Very rugged...
by Ben Cadwallader | Nov 26, 2025
Features • High speed switching SiC MOSFETs • Reliable body diode • All parts tested to greater than 1,350V • Kelvin reference for stable operation • Press fit terminal connections Benefits • Low switching losses • Low junction to case thermal resistance • Very rugged...
by Ben Cadwallader | Nov 26, 2025
Features • 62mm footprint with reduced package height (17 mm) • High speed switching SiC MOSFETs • All parts tested to greater than 1,350V • Kelvin reference for stable operation • Isolated baseplate Benefits • Lower inductance from reduced package height • Low...
by Ben Cadwallader | Nov 26, 2025
Features • 62mm footprint with reduced package height (17 mm) • High speed switching SiC MOSFETs • All parts tested to greater than 1,350V • Kelvin reference for stable operation • Isolated baseplate Benefits • Lower inductance from reduced package height • Low...
by Ben Cadwallader | Nov 21, 2025
Features • High speed switching SiC MOSFETs • Reliable body diode • All parts tested to greater than 1,350V • Kelvin reference for stable operation • Press fit terminal connections Benefits • Low switching losses • Low junction to case thermal resistance • Very rugged...